Invention Grant
- Patent Title: Methods of forming integrated circuits
- Patent Title (中): 形成集成电路的方法
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Application No.: US13248457Application Date: 2011-09-29
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Publication No.: US09263490B2Publication Date: 2016-02-16
- Inventor: Takeshi Yanagita , Hiroshi Ozaki , Shin Iwabuchi , Tomoharu Ogita
- Applicant: Takeshi Yanagita , Hiroshi Ozaki , Shin Iwabuchi , Tomoharu Ogita
- Applicant Address: JP
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2010-227756 20101007
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L27/146 ; H01L23/00
Abstract:
A solid-state imaging device includes a substrate in which a plurality of pixels including photoelectric converters are formed, a wiring layer that includes wirings in a plurality of layers formed via an interlayer insulating film in a front surface side of the substrate, a base electrode pad portion that includes a portion of the wirings formed in the wiring layer, an opening that penetrates the substrate from a rear surface side of the substrate and reaches the base electrode pad portion, and an embedded electrode pad layer that is formed so as to be embedded in the opening by electroless plating.
Public/Granted literature
- US20120086092A1 SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS Public/Granted day:2012-04-12
Information query
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