Invention Grant
- Patent Title: Method of manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US14287045Application Date: 2014-05-25
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Publication No.: US09263498B2Publication Date: 2016-02-16
- Inventor: Tadashi Yamaguchi
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2013-123698 20130612
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146

Abstract:
An improvement is achieved in the performance of a semiconductor device. In a method of manufacturing the semiconductor device, in an n-type semiconductor substrate, a p-type well as a p-type semiconductor region forming a part of a photodiode is formed and a gate electrode of a transfer transistor is formed. Then, after an n-type well as an n-type semiconductor region forming the other part of the photodiode is formed, a microwave is applied to the semiconductor substrate to heat the semiconductor substrate. Thereafter, a drain region of the transfer transistor is formed.
Public/Granted literature
- US20140370645A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-12-18
Information query
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