Invention Grant
- Patent Title: Semiconductor light emitting device and light coupling device
- Patent Title (中): 半导体发光器件和光耦合器件
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Application No.: US14020355Application Date: 2013-09-06
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Publication No.: US09263629B2Publication Date: 2016-02-16
- Inventor: Kenji Fujimoto
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Priority: JP2013-061143 20130322
- Main IPC: H01L31/167
- IPC: H01L31/167 ; H01L33/06

Abstract:
According to one embodiment, a semiconductor light emitting device includes a semiconductor laminated body provided on a semiconductor substrate. The semiconductor laminated body includes a light emitting layer. The light emitting layer includes a quantum well structure made by alternately laminating n (an integer of not less than 1) well layers and (n+1) barrier layers and emits light with a peak wavelength of 650 nm to 1000 nm. Each of the well layers has a thickness of smaller than 15 nm. Each of the barrier layers has a thickness of 15 nm to 50 nm.
Public/Granted literature
- US20140284548A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT COUPLING DEVICE Public/Granted day:2014-09-25
Information query
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