Invention Grant
- Patent Title: Metal material for electrical electronic component
- Patent Title (中): 电子元件用金属材料
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Application No.: US12601866Application Date: 2008-05-29
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Publication No.: US09263814B2Publication Date: 2016-02-16
- Inventor: Kazuo Yoshida , Kyota Susai , Takeo Uno , Shuichi Kitagawa , Kengo Mitose
- Applicant: Kazuo Yoshida , Kyota Susai , Takeo Uno , Shuichi Kitagawa , Kengo Mitose
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Kubotera & Associates, LLC
- Priority: JP2007-142469 20070529; JP2008-140186 20080528
- International Application: PCT/JP2008/059928 WO 20080529
- International Announcement: WO2008/146885 WO 20081204
- Main IPC: B32B15/01
- IPC: B32B15/01 ; C25D5/50 ; H01R13/03 ; C25D5/12 ; C25D7/00
Abstract:
A metallic material for an electrical electronic includes a CU—Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.
Public/Granted literature
- US20100304177A1 METAL MATERIAL FOR ELECTRICAL ELECTRONIC COMPONENT Public/Granted day:2010-12-02
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