Invention Grant
- Patent Title: Electrical press-fit pin for a semiconductor module
- Patent Title (中): 用于半导体模块的电压插头
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Application No.: US14154804Application Date: 2014-01-14
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Publication No.: US09263820B2Publication Date: 2016-02-16
- Inventor: Emilio Mattiuzzo
- Applicant: Vishay General Semiconductor LLC
- Applicant Address: US NY Hauppauge
- Assignee: Vishay General Semiconductor LLC
- Current Assignee: Vishay General Semiconductor LLC
- Current Assignee Address: US NY Hauppauge
- Agency: Mayer & Williams PC
- Agent Stuart H. Meyer
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R13/415 ; H01R43/26 ; H01R12/58

Abstract:
An electrical module includes a housing, at least one electrical component mounted within the housing and an electrical press-fit contact. The electrical press-fit contact is located in part within the housing and has a press fit portion and a stop portion at its distal end and a mounting portion at its proximal end. The mounting portion is electrically coupled to the electrical component. The press-fit portion is located exterior of the housing such that the stop portion is able to block movement of the press-fit section into the housing when a press-in force is introduced onto the press-in contact to press the press-fit contact into the housing.
Public/Granted literature
- US20140199861A1 ELECTRICAL PRESS-FIT PIN FOR A SEMICONDUCTOR MODULE Public/Granted day:2014-07-17
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