Invention Grant
- Patent Title: Slip ring for high speed data transmission
- Patent Title (中): 滑环,用于高速数据传输
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Application No.: US14698434Application Date: 2015-04-28
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Publication No.: US09263838B1Publication Date: 2016-02-16
- Inventor: Hong Zhang , Jingrong Shen , Joe Ritacco , Boying B. Zhang
- Applicant: Princetel Inc.
- Applicant Address: US NJ Hamilton
- Assignee: PRINCETEL, INC.
- Current Assignee: PRINCETEL, INC.
- Current Assignee Address: US NJ Hamilton
- Main IPC: H01R39/18
- IPC: H01R39/18 ; H01R39/08 ; H02K13/00

Abstract:
The current invention is regarding a slip ring for transmitting high speed electrical signal across a rotating interface, especially for transmitting Ethernet data. It consists of sandwich assembly with multiple conducting plates individually sandwiched by multiple insulating spacers and a brush block assembly with multiple conducting brushes. The input Ethernet cable is attached on said sandwich assembly and the wires from input cable can be individually soldered into the central hole of each conducting plate (The wires are always off-centered in prior art). The output Ethernet cable is soldered on said brush block. Said brush block assembly and said sandwich assembly are rotatable relative to each other through bearings to form a rotational interface. As a result, high speed electrical signal can be transmitted across the rotating interface without suffering from phase shift and data distortion as in prior arts due to unequal path lengths.
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