Invention Grant
- Patent Title: Impedance matching system for slab type lasers
- Patent Title (中): 板式激光器阻抗匹配系统
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Application No.: US14566494Application Date: 2014-12-10
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Publication No.: US09263849B2Publication Date: 2016-02-16
- Inventor: Gerald L Kern
- Applicant: Gerald L Kern
- Agency: Merchant & Gould P.C.
- Main IPC: H01S3/097
- IPC: H01S3/097 ; H05K1/16 ; H01R24/44 ; H01S3/0971 ; H01S3/223 ; H01S3/03

Abstract:
A system transfers radio frequency energy from a radio frequency power amplifier (RFPA) to a slab laser. The system includes a connector, a printed circuit board, a conductive plate and a first inductor element. The connector is configured to receive a radio frequency power from the RFPA. The printed circuit board has at least one conductive pad etched on the printed circuit board. One of the conductive pads is electrically connected to the connector. The conductive plate is attached beneath the printed circuit board. The first inductor is electrically connected to the connector and electrically connected to a first electrode or top slab of the slab laser.
Public/Granted literature
- US20150188282A1 IMPEDANCE MATCHING SYSTEM FOR SLAB TYPE LASERS Public/Granted day:2015-07-02
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