Invention Grant
- Patent Title: Communication circuit and semiconductor device
- Patent Title (中): 通信电路和半导体器件
-
Application No.: US14732557Application Date: 2015-06-05
-
Publication No.: US09264083B2Publication Date: 2016-02-16
- Inventor: Shigeyuki Okabe
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2012-143698 20120627
- Main IPC: H04B3/00
- IPC: H04B3/00 ; H04L25/00 ; H04B1/10 ; H03K19/003 ; H04B1/12 ; H04B15/02 ; H04L29/08

Abstract:
A communication circuit, includes a receiver that provides communication by using a first transmission path and a second transmission path, the first transmission path being used to transmit a first signal, and the second transmission path being used to transmit a second signal; wherein the receiver includes a compensation circuit that compensates for an attenuation of a current when noise is superimposed on the first signal and on the second signal; wherein the compensation circuit includes a first compensation circuit; and wherein the first compensation circuit detects an electric current attenuation of the first signal when the noise is superimposed on the first signal, and compensates for the attenuation of the first signal by adding the detected electric current attenuation to the second signal.
Public/Granted literature
- US20150270858A1 COMMUNICATION CIRCUIT AND SEMICONDUCTOR DEVICE Public/Granted day:2015-09-24
Information query