Invention Grant
- Patent Title: Silicon condenser microphone
- Patent Title (中): 硅电容麦克风
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Application No.: US14284651Application Date: 2014-05-22
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Publication No.: US09264815B2Publication Date: 2016-02-16
- Inventor: Kai Wang , Zhijiang Wu
- Applicant: Kai Wang , Zhijiang Wu
- Applicant Address: CN Shenzhen
- Assignee: AAC Acoustic Technologies(Shenzhen) Co., Ltd.
- Current Assignee: AAC Acoustic Technologies(Shenzhen) Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: IPro, Inc.
- Agent Na Xu
- Priority: CN201320881507U 20131230
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R19/00

Abstract:
A silicon condenser microphone is disclosed. The silicon condenser microphone includes a substrate having a top surface, a lower surface opposed to the top surface, and a recess concave from the top surface toward the lower surface. The recess includes a bottom for carrying a chip thereon. The microphone further includes a transducer spanning the recess. By virtue of this configuration, the size of the microphone is reduced, and acoustic performance of the microphone is accordingly improved.
Public/Granted literature
- US20150189446A1 Silicon Condenser Microphone Public/Granted day:2015-07-02
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