Embodiments of the invention relates to a process and assembly for a dual sided and staggered connector arrangement on a substrate. Surface mount connector technology is employed to enable a flush connection of connector leads to the surface of the substrate. Retaining pins are provided with each connector and are sized to be received by the substrate, but not to extend through the substrate. The retaining pins are sized and configured to hold each connector in a set position, while mitigating interference with an opposing side of the PCB.