Invention Grant
US09265156B2 Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured film
有权
可固化组合物，由可固化组合物制备的固化涂膜，以及包含固化膜的印刷线路板
- Patent Title: Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured film
- Patent Title (中): 可固化组合物，由可固化组合物制备的固化涂膜，以及包含固化膜的印刷线路板
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Application No.: US14227249Application Date: 2014-03-27
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Publication No.: US09265156B2Publication Date: 2016-02-16
- Inventor: Masayuki Shimura , Yoshiyuki Furuta , Masao Yumoto , Shoji Minegishi
- Applicant: TAIYO INK MFG. CO., LTD.
- Applicant Address: JP Hiki-gun
- Assignee: Taiyo Ink Mfg. Co., Ltd.
- Current Assignee: Taiyo Ink Mfg. Co., Ltd.
- Current Assignee Address: JP Hiki-gun
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-074507 20130329; JP2013-243864 20131126
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08G61/04 ; H05K3/28 ; H05K1/03
Abstract:
A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.
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