Invention Grant
- Patent Title: Housing and electronic device using the housing
- Patent Title (中): 住房和电子设备使用住房
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Application No.: US13869709Application Date: 2013-04-24
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Publication No.: US09265169B2Publication Date: 2016-02-16
- Inventor: Shu-Xiang Zhou , Jun Xiong
- Applicant: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. , FIH (Hong Kong) Limited
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.,FIH (Hong Kong) Limited
- Current Assignee: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201310004424 20130107
- Main IPC: H05K5/04
- IPC: H05K5/04 ; C25D11/24 ; H05K5/02
Abstract:
A housing includes a substrate made of aluminum or aluminum alloy, an anodic oxide film disposed on the substrate, and an abrasion resisting layer disposed on the anodic oxide film. The abrasion resisting layer is an alkylate silicon dioxide layer containing nano aluminum oxide powder. An electronic device using the housing is also described.
Public/Granted literature
- US20140190739A1 HOUSING AND ELECTRONIC DEVICE USING THE HOUSING Public/Granted day:2014-07-10
Information query
