Invention Grant
- Patent Title: Method of manufacturing a sensor
- Patent Title (中): 制造传感器的方法
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Application No.: US13780731Application Date: 2013-02-28
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Publication No.: US09266267B2Publication Date: 2016-02-23
- Inventor: Edmond De Volder , Dietmar Huber , Andreas Doering , Jakob Schillinger , Martin Watzlawik , Lothar Biebricher
- Applicant: Continental Teves AG & Co. oHG
- Applicant Address: DE
- Assignee: Continental Teves AG & Co. oHG
- Current Assignee: Continental Teves AG & Co. oHG
- Current Assignee Address: DE
- Agency: RatnerPrestia
- Priority: DE102008049958 20081002; DE102008064047 20081219
- Main IPC: H05K3/30
- IPC: H05K3/30 ; B29C45/14 ; B29C33/12 ; B29C45/16 ; G01D11/24 ; G01P1/02
Abstract:
A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.
Public/Granted literature
- US20130175733A1 SENSOR ELEMENT AND CARRIER ELEMENT FOR MANUFACTURING A SENSOR Public/Granted day:2013-07-11
Information query
