Invention Grant
- Patent Title: Separating apparatus
- Patent Title (中): 分离装置
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Application No.: US14134052Application Date: 2013-12-19
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Publication No.: US09266315B2Publication Date: 2016-02-23
- Inventor: Kentaro Iizuka
- Applicant: Disco Corporation
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2013-006184 20130117
- Main IPC: B32B38/10
- IPC: B32B38/10 ; B32B43/00 ; H01L21/00 ; H01L21/687

Abstract:
A separating apparatus for separating a composite substrate into a first substrate and a second substrate previously bonded to each other. The separating apparatus includes a support base having a supporting surface for supporting the composite substrate, a pair of side surface supporting rollers for supporting the peripheral side surface of the composite substrate placed on the supporting surface, and a separating unit for applying a separating force to the boundary between the first substrate and the second substrate constituting the composite substrate supported to the supporting surface of the support base and the side surface supporting rollers, thereby separating the composite substrate into the first substrate and the second substrate.
Public/Granted literature
- US20140196855A1 SEPARATING APPARATUS Public/Granted day:2014-07-17
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