Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US14627845Application Date: 2015-02-20
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Publication No.: US09266327B2Publication Date: 2016-02-23
- Inventor: Eiju Hirai , Shiro Yazaki , Motoki Takabe , Yuma Fukuzawa
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2014-037678 20140228
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14

Abstract:
A liquid ejecting head includes a pressure chamber forming substrate in which a plurality of spaces to be pressure chambers in communication with nozzles are provided side by side in a nozzle column direction, in which in a region corresponding to the pressure chamber, a lower electrode film is formed with a width of 50% or more and 80% or less of a width of the pressure chamber in the nozzle column direction and the piezoelectric body layer covers the lower electrode film in the nozzle column direction and is formed with a width of 90% or less of the width of the pressure chamber.
Public/Granted literature
- US20150246538A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2015-09-03
Information query
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