Invention Grant
- Patent Title: Manufacturing method of substrate for liquid ejection head
- Patent Title (中): 液体喷射头基板的制造方法
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Application No.: US13926651Application Date: 2013-06-25
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Publication No.: US09266331B2Publication Date: 2016-02-23
- Inventor: Sadayoshi Sakuma , Hirokazu Komuro , Yuzuru Ishida , Kazuaki Shibata , Makoto Sakurai
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2012-154598 20120710
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B41J2/16 ; B41J2/14

Abstract:
Provided is a method for manufacturing a substrate for liquid ejection head including an ejection energy generating element and a nozzle layer including an ejection port and a liquid channel. The method includes the steps of: forming, on the substrate including the element, a metal mold member made of metal and having a flat surface, the metal mold member making up at least a part of a mold for the liquid channel, and a planarization layer made of the metal and having a flat surface to planarize a surface of the nozzle layer; coating the mold for the liquid channel and the planarization layer with negative-type photosensitive resin, thus forming a negative-type photosensitive resin layer to be the nozzle layer; exposing the resin layer to ultraviolet rays, thus forming the ejection port; and selectively removing the mold for the liquid channel, thus forming the liquid channel.
Public/Granted literature
- US20140013600A1 MANUFACTURING METHOD OF SUBSTRATE FOR LIQUID EJECTION HEAD Public/Granted day:2014-01-16
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