Invention Grant
US09266713B2 MEMS backplate, MEMS microphone comprising a MEMS backplate and method for manufacturing a MEMS microphone
有权
MEMS背板，包括MEMS背板的MEMS麦克风和用于制造MEMS麦克风的方法
- Patent Title: MEMS backplate, MEMS microphone comprising a MEMS backplate and method for manufacturing a MEMS microphone
- Patent Title (中): MEMS背板，包括MEMS背板的MEMS麦克风和用于制造MEMS麦克风的方法
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Application No.: US13261882Application Date: 2011-11-14
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Publication No.: US09266713B2Publication Date: 2016-02-23
- Inventor: Leif Steen Johansen , Jan Tue Ravnkilde , Pirmin Hermann Otto Rombach , Kurt Rasmussen , Dennis Mortensen
- Applicant: Leif Steen Johansen , Jan Tue Ravnkilde , Pirmin Hermann Otto Rombach , Kurt Rasmussen , Dennis Mortensen
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- International Application: PCT/EP2011/070067 WO 20111114
- International Announcement: WO2013/071950 WO 20130523
- Main IPC: B81B3/00
- IPC: B81B3/00 ; H04R19/00 ; B81C1/00 ; H04R31/00
Abstract:
A MEMS backplate enables MEMS microphones with reduced parasitic capacitance. The MEMS backplate includes a central area and a perforation in the central area. A suspension area surrounds the central area at least partially. An aperture is disposed in the suspension area.
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