Invention Grant
- Patent Title: Micro-electro mechanical system (MEMS) structures and methods of forming the same
- Patent Title (中): 微机电系统（MEMS）结构及其形成方法
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Application No.: US14253224Application Date: 2014-04-15
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Publication No.: US09266714B2Publication Date: 2016-02-23
- Inventor: Chia-Pao Shu , Chia-Ming Hung , Wen-Chuan Tai , Hung-Sen Wang , Hsiang-Fu Chen , Alex Kalnitsky
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A device includes a first substrate bonded with a second substrate structure. The second substrate structure includes an outgasing prevention structure. At least one micro-electro mechanical system (MEMS) device is disposed over the outgasing prevention structure.
Public/Granted literature
- US20140203421A1 MICRO-ELECTRO MECHANICAL SYSTEM (MEMS) STRUCTURES AND METHODS OF FORMING THE SAME Public/Granted day:2014-07-24
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