The present disclosure relates to the field of integrated circuit packaging and, more particularly, to packages using embedded microelectronic die applications, such a bumpless build-up layer (BBUL) designs. Embodiments of the present description relate to the field of alignment correction of microelectronic dice within the bumpless build-up layer packages. This alignment correction may comprise characterizing the misalignment of each microelectronic die mounted on a carrier and forwarding this characterization, along with data regarding the orientation of the carrier, to processing equipment that can compensate for the misalignment of each microelectronic die.