A portion of an SiO2 layer 240 on a peripheral portion 255 of an actuator body portion 251 is left on the surface of the actuator body portion 251 when it is etched so as to extend over the outside of the piezoelectric element 4. When the third resist mask 330 covering the actuator body portion 251 and the mirror portion 252 is formed and etching is performed, the third resist mask 330 has a first slit 331 and a second slit 332, the second slit 332 exposing a peripheral portion 256 of a mirror portion 252, and the first slits 331 exposing a peripheral portion 256 of the actuator body portion 251 and a portion of the SiO2 layer 240 on the actuator body portion 251, and having a width wider than the second slit 332.