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US09268227B2 UV-curable adhesive silicone composition, UV-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same 有权
紫外线固化性粘合性有机硅组合物，紫外线固化性粘合性硅酮组合物片，光学半导体装置及其制造方法

UV-curable adhesive silicone composition, UV-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same
Abstract:
A method of manufacturing an optical semiconductor apparatus includes: cutting a UV-curable adhesive silicone composition sheet into small chips; disposing the resulted chip on a surface of an optical semiconductor device; irradiating UV-rays to the chip via a photomask according to lithography; developing an uncured portion of the chip with a solvent; and heat-curing after that. The UV-curable adhesive silicone composition sheet is obtained by forming a UV-curable adhesive silicone composition into sheet-form, the UV-curable adhesive silicone composition including: (A) an organopolysiloxane having a resin structure of R1SiO3/2, R22SiO2/2, and R3aR4bSiO(4-a-b)/2 units, (B) an organohydrogenpolysiloxane having a resin structure of R1SiO3/2, R22SiO2/2, and R3cHdSiO(4-c-d)/2 units, and (C) a photoactive catalyst. The UV-curable adhesive silicone composition is in a plastic solid state or a semi-solid state in an uncured state at room temperature.
Abstract(Chinese):

一种光学半导体装置的制造方法，其特征在于，将紫外线固化性粘合性硅酮组合物片切割成小片; 将得到的芯片设置在光学半导体器件的表面上; 根据光刻法通过光掩模将紫外线照射到芯片; 用溶剂开发芯片的未固化部分; 并在此之后进行热固化。 通过将UV固化型粘合性硅氧烷组合物形成为片状，得到紫外线固化型粘性有机硅组合物片，所述UV固化性粘合性有机硅组合物包含：（A）具有R 1 SiO 3/2，R 22 SiO 2/2的树脂结构的有机聚硅氧烷 ，和R 3 a R 4 b SiO（4-ab）/ 2单元，（B）具有R 1 SiO 3/2，R 22 SiO 2/2和R 3 c H d SiO（4-cd）/ 2单元的树脂结构的有机氢聚硅氧烷，和（C）光活性催化剂。 紫外线固化性粘合性有机硅组合物在室温下处于未固化状态的塑料固态或半固态。

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