Invention Grant
- Patent Title: Apparatus for and method of screwless assembly and adjustable damping structure for panel stress relief
- Patent Title (中): 无螺丝组装及面板应力消除调节阻尼结构的装置及方法
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Application No.: US12627938Application Date: 2009-11-30
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Publication No.: US09268360B2Publication Date: 2016-02-23
- Inventor: Chung-Kuo Weng
- Applicant: Chung-Kuo Weng
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Haverstock & Owens LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G11B33/08 ; G11B33/12

Abstract:
An electronic component assembly and vibration reduction device having screwless design with cantilever clips to clam and locate the electronic panels onto the mounting brackets or fasten the information storage devices onto cases are disclosed. The cantilever clip contain damping structures, which can generate damping effect to reduce vibrations. The effectiveness of the damping structure can be adjusted through the adjustment of the length, thickness, materials and other factors of the cantilever clip. The damping effect is generated by moving the cantilever clips in an oscillatory manner.
Public/Granted literature
- US20110128696A1 APPARATUS FOR AND METHOD OF SCREWLESS ASSEMBLY AND ADJUSTABLE DAMPING STRUCTURE FOR PANEL STRESS RELIEF Public/Granted day:2011-06-02
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