Invention Grant
- Patent Title: Multilayer ceramic capacitor and mounting circuit board therefor
- Patent Title (中): 多层陶瓷电容器及其安装电路板
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Application No.: US14067904Application Date: 2013-10-30
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Publication No.: US09269491B2Publication Date: 2016-02-23
- Inventor: Sang Soo Park , Heung Kil Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0080242 20130709
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H01G2/06 ; H01G4/30 ; H01G4/252 ; H05K3/34 ; H05K1/18 ; H01G4/005

Abstract:
There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes disposed to face each other within a ceramic body, and having respective lead portions exposed to an upper surface of the ceramic body; first and second external electrodes formed on the upper surface of the ceramic body and connected to the lead portions, respectively; and first and second terminal frames each including a vertical portion facing end surfaces of the ceramic body and upper and lower horizontal portions facing upper and lower surfaces of the ceramic body, respectively, wherein the upper horizontal portions are connected to the first and second external electrodes, respectively, and adhesive layers are provided between the upper horizontal portions and the first and second external electrodes, respectively.
Public/Granted literature
- US20150014038A1 MULTILAYER CERAMIC CAPACITOR AND MOUNTING CIRCUIT BOARD THEREFOR Public/Granted day:2015-01-15
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