Invention Grant
- Patent Title: High power ceramic on copper package
- Patent Title (中): 大功率陶瓷铜包装
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Application No.: US13343733Application Date: 2012-01-05
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Publication No.: US09269594B2Publication Date: 2016-02-23
- Inventor: Anwar Mohammed , Julius Chew , Donald Fowlkes
- Applicant: Anwar Mohammed , Julius Chew , Donald Fowlkes
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/50 ; H01L23/14 ; H01L23/373 ; H01L23/00
Abstract:
According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the heat sink on the same side as the lead frame with an electrically conductive material having a melting point of 280° C. or greater.
Public/Granted literature
- US20120104582A1 High Power Ceramic on Copper Package Public/Granted day:2012-05-03
Information query
IPC分类:
