Invention Grant
- Patent Title: Narrow-gap flip chip underfill composition
- Patent Title (中): 窄间隙倒装芯片底层填料组成
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Application No.: US14135236Application Date: 2013-12-19
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Publication No.: US09269596B2Publication Date: 2016-02-23
- Inventor: Yonghao Xiu , Nisha Ananthakrishnan , Yiqun Bai , Arjun Krishnan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/56 ; H01L23/00
Abstract:
An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.
Public/Granted literature
- US20150179478A1 NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION Public/Granted day:2015-06-25
Information query
IPC分类:
