Invention Grant
- Patent Title: Substrate gripping apparatus
- Patent Title (中): 基板夹持装置
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Application No.: US14150257Application Date: 2014-01-08
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Publication No.: US09269605B2Publication Date: 2016-02-23
- Inventor: Mitsuru Miyazaki , Naoki Matsuda , Junji Kunisawa , Manao Hoshina
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2013-003291 20130111
- Main IPC: H01L21/687
- IPC: H01L21/687

Abstract:
The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.
Public/Granted literature
- US20140197610A1 SUBSTRATE GRIPPING APPARATUS Public/Granted day:2014-07-17
Information query
IPC分类: