Invention Grant
US09269639B2 Method of detecting and measuring contact alignment shift relative to gate structures in a semicondcutor device
有权
检测和测量相对于半切割器件中的栅极结构的接触对准移动的方法
- Patent Title: Method of detecting and measuring contact alignment shift relative to gate structures in a semicondcutor device
- Patent Title (中): 检测和测量相对于半切割器件中的栅极结构的接触对准移动的方法
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Application No.: US14040730Application Date: 2013-09-30
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Publication No.: US09269639B2Publication Date: 2016-02-23
- Inventor: Rongwei Fan , Feijue Liu , Yin Long , Qiliang Ni , Hunglin Chen
- Applicant: Shanghai Huali Microelectronics Corporation
- Applicant Address: CN Shanghai
- Assignee: Shanghai Huali Microelectronics Corporation
- Current Assignee: Shanghai Huali Microelectronics Corporation
- Current Assignee Address: CN Shanghai
- Priority: CN201310256841 20130625
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66

Abstract:
The present invention provides a method of detecting and measuring the alignment shift of the contacts relative to the gate structures. The method comprises: designing a test model array having different test model regions on the substrate; forming second conductivity type doped well regions, gate structures, and first conductivity type doped active regions in each of the test model regions; forming contacts in each of the test model region; scanning the test model array by an electron-beam inspector to obtain light-dark patterns of the contacts; and detecting and measuring the alignment shift of the contacts relative to the gate structures according to the light-dark patterns of the contacts and the critical dimensions of the transistors in the test model regions.
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