Invention Grant
US09269653B2 SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
有权
SGS或GSGSG模式用于信号传输通道，以及PCB组装，芯片封装采用SGS或GSGSG格式
- Patent Title: SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
- Patent Title (中): SGS或GSGSG模式用于信号传输通道，以及PCB组装，芯片封装采用SGS或GSGSG格式
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Application No.: US13892323Application Date: 2013-05-13
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Publication No.: US09269653B2Publication Date: 2016-02-23
- Inventor: Nan-Jang Chen , Yau-Wai Wong
- Applicant: MEDIATEK INC.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H01L23/495 ; H05K1/02
Abstract:
A printed circuit board (PCB) assembly includes a PCB having a core substrate, a plurality of conductive traces on a first surface of the PCB, and a ground layer on the second surface of the PCB. The conductive traces comprise a pair of differential signal traces. An intervening reference trace is disposed between the differential signal traces. A connector is disposed at one end of the plurality of conductive traces. A semiconductor package is mounted on the first surface at the other end of the plurality of conductive traces.
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