Invention Grant
US09269657B2 Flexible stack packages, electronic systems including the same, and memory cards including the same
有权
灵活的堆叠包装，包括它们的电子系统和包括它们的存储卡
- Patent Title: Flexible stack packages, electronic systems including the same, and memory cards including the same
- Patent Title (中): 灵活的堆叠包装，包括它们的电子系统和包括它们的存储卡
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Application No.: US14081020Application Date: 2013-11-15
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Publication No.: US09269657B2Publication Date: 2016-02-23
- Inventor: Jong Hoon Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2013-0065006 20130605
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L25/10
Abstract:
Flexible stack packages are provided. The flexible stack package includes a first unit package and a second unit package which are sequentially stacked. Each of the first and second unit packages has a fixed area and a floating area. The fixed area of the first unit package is connected and fixed to the fixed area of the second unit package by a fixing part.
Public/Granted literature
- US20140361427A1 FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME Public/Granted day:2014-12-11
Information query
IPC分类:
