Invention Grant
- Patent Title: Integrated circuit having electromagnetic shielding capability and manufacturing method thereof
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Application No.: US14728830Application Date: 2015-06-02
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Publication No.: US09269674B2Publication Date: 2016-02-23
- Inventor: Chao-Cheng Lee , Wen-Shan Wang
- Applicant: REALTEK SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C.
- Agent Anthony King
- Priority: TW103120794A 20140617
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L23/58 ; H01L23/528 ; H01L23/00 ; H01L23/50 ; H01L21/768 ; H01L21/3205

Abstract:
The present invention discloses an integrated circuit having electromagnetic shielding capability and the manufacturing method thereof. An embodiment of the said integrated circuit comprises: a semiconductor circuit structure including a first surface which covers an electromagnetic radiation area; an electromagnetic shielding layer covering the first surface and including at least one contact; and at least one conducting path operable to electrically connect the at least one contact with a steady voltage and thereby shield off the electromagnetic wave from the electromagnetic radiation area, wherein the current running through the electromagnetic shielding layer is zero or less than the maximum current running through the electromagnetic radiation area.
Public/Granted literature
- US20150364429A1 Integrated circuit having electromagnetic shielding capability and manufacturing method thereof Public/Granted day:2015-12-17
Information query
IPC分类: