Invention Grant
US09269792B2 Method and structure for robust finFET replacement metal gate integration
有权
坚固的finFET替代金属栅极集成的方法和结构
- Patent Title: Method and structure for robust finFET replacement metal gate integration
- Patent Title (中): 坚固的finFET替代金属栅极集成的方法和结构
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Application No.: US14299300Application Date: 2014-06-09
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Publication No.: US09269792B2Publication Date: 2016-02-23
- Inventor: Kangguo Cheng , Shom S. Ponoth , Raghavasimhan Sreenivasan , Theodorus E. Standaert , Tenko Yamashita
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66

Abstract:
A robust gate spacer that can resist a long overetch that is required to form gate spacers in fin field effect transistors (FinFETs) and a method of forming the same are provided. The gate spacer includes a first gate spacer adjacent sidewalls of at least one hard mask and a top portion of sacrificial gate material of a sacrificial gate structure and a second gate spacer located beneath the first gate spacer and adjacent remaining portions of sidewalls of the sacrificial gate material. The first gate spacers is composed of a material having a high etch resistance that is not prone to material loss during subsequent exposure to dry or wet etch chemicals employed to form the second gate spacer and to remove the hard mask.
Public/Granted literature
- US20150357440A1 METHOD AND STRUCTURE FOR ROBUST FINFET REPLACEMENT METAL GATE INTEGRATION Public/Granted day:2015-12-10
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