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US09269848B2 Method for producing a plurality of optoelectronic semiconductor components in combination, semiconductor component produced in such a way, and use of said semiconductor component 有权
组合生产多个光电子半导体元件的方法，以这种方式制造的半导体元件以及所述半导体元件的使用

Method for producing a plurality of optoelectronic semiconductor components in combination, semiconductor component produced in such a way, and use of said semiconductor component
Abstract:
A method for producing a plurality of optoelectronic semiconductor components in combination is specified. A plurality of radiation-emitting and radiation-detecting semiconductor chips are applied on a carrier substrate. The semiconductor chips are potted with a respective potting compound. The potting compounds are subsequently severed by sawing between adjacent semiconductor chips. A common frame is subsequently applied to the carrier substrate The common frame has a plurality of chambers open toward the top. The frame is arranged in such a way that a respective semiconductor chip is arranged in a respective chamber of the frame. A semiconductor component produced in such a way and the use of the semiconductor component are furthermore specified.
Abstract(Chinese):

规定组合多个光电子半导体部件的制造方法。 多个辐射发射和辐射检测半导体芯片被施加在载体衬底上。 半导体芯片用相应的封装化合物封装。 灌封化合物随后通过在相邻的半导体芯片之间锯切而被切断。 随后将一个共同的框架应用于载体基板。公共框架具有朝向顶部开口的多个室。 框架布置成使得相应的半导体芯片布置在框架的相应室中。 进一步规定以这种方式制造的半导体部件和半导体部件的使用。

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