Invention Grant
US09269854B2 Methods of fabricating optoelectronic devices using layers detached from semiconductor donors and devices made thereby
有权
使用从半导体供体分离的层和由此制成的器件制造光电子器件的方法
- Patent Title: Methods of fabricating optoelectronic devices using layers detached from semiconductor donors and devices made thereby
- Patent Title (中): 使用从半导体供体分离的层和由此制成的器件制造光电子器件的方法
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Application No.: US13816798Application Date: 2011-03-21
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Publication No.: US09269854B2Publication Date: 2016-02-23
- Inventor: Ajaykumar R. Jain
- Applicant: Ajaykumar R. Jain
- Applicant Address: US VT Shelburne
- Assignee: VerLASE Technologies LLC
- Current Assignee: VerLASE Technologies LLC
- Current Assignee Address: US VT Shelburne
- Agency: Downs Rachlin and Martin, PLLC
- International Application: PCT/US2011/029190 WO 20110321
- International Announcement: WO2012/033551 WO 20120315
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/06 ; H01L21/02 ; H01L33/08

Abstract:
Methods of making optoelectronic devices containing functional elements made from layers liberated from natural and/or fabricated lamellar semiconductor donors. In one embodiment, a donor is provided, a layer is detached from the donor, and the layer is incorporated into an optoelectronic device as a functional element thereof. The thickness of the detached layer is tuned as needed to suit the functionality of the functional element. Examples of functional elements that can be made using detached layers include p-n junctions, Schotkey junctions, PIN junctions, and confinement layers, among others. Examples of optoelectronic devices that can incorporate detached layers include LEDs, laser diodes, MOSFET transistors, and MISFET transistors, among others.
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