Invention Grant
US09269858B2 Engineered substrates for semiconductor devices and associated systems and methods
有权
用于半导体器件的工程衬底及相关系统和方法
- Patent Title: Engineered substrates for semiconductor devices and associated systems and methods
- Patent Title (中): 用于半导体器件的工程衬底及相关系统和方法
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Application No.: US13223162Application Date: 2011-08-31
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Publication No.: US09269858B2Publication Date: 2016-02-23
- Inventor: Martin F. Schubert , Cem Basceri , Vladimir Odnoblyudov , Casey Kurth , Thomas Gehrke
- Applicant: Martin F. Schubert , Cem Basceri , Vladimir Odnoblyudov , Casey Kurth , Thomas Gehrke
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L21/00 ; H01L33/02 ; H01L33/00 ; H01L33/16 ; H01L33/46

Abstract:
Engineered substrates for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a transducer structure having a plurality of semiconductor materials including a radiation-emitting active region. The device further includes an engineered substrate having a first material and a second material, at least one of the first material and the second material having a coefficient of thermal expansion at least approximately matched to a coefficient of thermal expansion of at least one of the plurality of semiconductor materials. At least one of the first material and the second material is positioned to receive radiation from the active region and modify a characteristic of the light.
Public/Granted literature
- US20130049043A1 ENGINEERED SUBSTRATES FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2013-02-28
Information query
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