Provided are resistive random access memory (ReRAM) cells and methods of fabricating thereof. The ReRAM cells may include a first layer operable as a bottom electrode and a second layer operable to switch between a first resistive state and a second resistive state. The ReRAM cells may include a third layer that includes a material having a lower breakdown voltage than the second layer and further includes a conductive path created by electrical breakdown. The third layer may include any of tantalum oxide, titanium oxide, and zirconium oxide. Moreover, the third layer may include a binary nitride or a ternary nitride. The binary nitrides may include any of tantalum, titanium, tungsten, and molybdenum. The ternary nitrides may include silicon or aluminum and any of tantalum, titanium, tungsten, and molybdenum. The ReRAM cells may further include a fourth layer operable as a top electrode.