Invention Grant
- Patent Title: Substrate connector
- Patent Title (中): 基板连接器
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Application No.: US14488822Application Date: 2014-09-17
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Publication No.: US09270044B2Publication Date: 2016-02-23
- Inventor: Terufumi Hara
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2012-095807 20120419
- Main IPC: H01R13/24
- IPC: H01R13/24 ; H01R12/71 ; H01R13/629 ; H01R4/48

Abstract:
There are provided in the substrate connector a connector main body that has a leading end face butted against the circuit board, thereby bringing leading end faces of terminal fitting, which are housed and retained in the connector main body, with contact point patterns on the circuit board, thereby butting; and a connector receiving member that is attached to the circuit board and that holds the leading end face of the connector main body butted against the surface of the circuit board. The terminal fitting is provided by spring pieces that impart predetermined contact pressure as a result of contact points, which contact the contact point patterns, experiencing elastic deformation upon contact with the corresponding contact point patterns.
Public/Granted literature
- US20150004812A1 SUBSTRATE CONNECTOR Public/Granted day:2015-01-01
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