Invention Grant
- Patent Title: Power supply device
- Patent Title (中): 电源设备
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Application No.: US14190180Application Date: 2014-02-26
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Publication No.: US09271408B2Publication Date: 2016-02-23
- Inventor: Mieko Fujisaki , Kazuya Takahashi , Natsuko Omomo
- Applicant: TDK Corporation
- Applicant Address: JP
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-066442 20130327; JP2013-071131 20130329
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A power supply device includes a circuit board that has an arrangement surface and a rear surface opposite to the arrangement surface and that has a through hole. An insertion mounted circuit component, a connector and a surface mounted light emitting component that is provided for confirming an operation of the power supply device are assembled on the arrangement surface. A chassis holds the circuit board from the sides and the rear surface of the circuit board and has an opening to expose the connector. The surface mounted light emitting component is surface mounted on the rear surface of the circuit board. The through hole is provided near the surface mounted light emitting component so as to guide light emitted from the surface mounted light emitting component toward the opening of the chassis.
Public/Granted literature
- US20140293556A1 POWER SUPPLY DEVICE Public/Granted day:2014-10-02
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