Invention Grant
- Patent Title: Flexible electronic circuit enclosure assembly
- Patent Title (中): 灵活的电子电路外壳组件
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Application No.: US14000763Application Date: 2012-03-09
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Publication No.: US09271430B2Publication Date: 2016-02-23
- Inventor: Chris R. Snider
- Applicant: Chris R. Snider
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Lawrence D. Hazelton
- International Application: PCT/US2012/028416 WO 20120309
- International Announcement: WO2012/125436 WO 20120920
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K13/00

Abstract:
A flexible enclosure assembly for an electronic device for vehicular application is virtually “fastenerless” and includes a preform blank of conductive sheet material such as wire screen mesh or the like which defines upper, lower and a plurality of side wall portions flexibly interconnected by living hinges. A framework of resilient elastomeric material is insert molded to the preform blank to provide three-dimensional case details to accept one or more electronic devices such as circuit boards required for electrical control and display of vehicle based systems. The conductive sheet material is preferably a wire mesh which provides shielding from electrical anomalies and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.
Public/Granted literature
- US20130333941A1 FLEXIBLE ELECTRONIC CIRCUIT ENCLOSURE ASSEMBLY Public/Granted day:2013-12-19
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