Invention Grant
US09271430B2 Flexible electronic circuit enclosure assembly 有权
灵活的电子电路外壳组件

  • Patent Title: Flexible electronic circuit enclosure assembly
  • Patent Title (中): 灵活的电子电路外壳组件
  • Application No.: US14000763
    Application Date: 2012-03-09
  • Publication No.: US09271430B2
    Publication Date: 2016-02-23
  • Inventor: Chris R. Snider
  • Applicant: Chris R. Snider
  • Applicant Address: US MI Troy
  • Assignee: Delphi Technologies, Inc.
  • Current Assignee: Delphi Technologies, Inc.
  • Current Assignee Address: US MI Troy
  • Agent Lawrence D. Hazelton
  • International Application: PCT/US2012/028416 WO 20120309
  • International Announcement: WO2012/125436 WO 20120920
  • Main IPC: H05K9/00
  • IPC: H05K9/00 H05K13/00
Flexible electronic circuit enclosure assembly
Abstract:
A flexible enclosure assembly for an electronic device for vehicular application is virtually “fastenerless” and includes a preform blank of conductive sheet material such as wire screen mesh or the like which defines upper, lower and a plurality of side wall portions flexibly interconnected by living hinges. A framework of resilient elastomeric material is insert molded to the preform blank to provide three-dimensional case details to accept one or more electronic devices such as circuit boards required for electrical control and display of vehicle based systems. The conductive sheet material is preferably a wire mesh which provides shielding from electrical anomalies and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.
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