Invention Grant
- Patent Title: Liquid processing apparatus
- Patent Title (中): 液体处理设备
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Application No.: US13784932Application Date: 2013-03-05
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Publication No.: US09272310B2Publication Date: 2016-03-01
- Inventor: Koji Egashira
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2012-053459 20120309
- Main IPC: B08B3/02
- IPC: B08B3/02 ; H01L21/67 ; H01L21/687

Abstract:
A liquid processing apparatus includes a substrate holding unit and an elevating member provided to ascend/descend with respect to the substrate holding unit. The substrate holding unit includes a holding base, and a first engagement member and a second engagement member which are provided to be movable in the holding base, and moved between an engaging position where the member is engaged with the peripheral edge of the substrate and a releasing position where the member releases the substrate. When the first contact unit connected to the first engagement member is in contact with a first portion to be contacted, the first engagement member is located at the engaging position. When the second contact unit connected to the second engagement member is in contact with a second portion to be contacted at a lower position than the first portion, the second engagement member is located at the engaging position.
Public/Granted literature
- US20130233361A1 LIQUID PROCESSING APPARATUS Public/Granted day:2013-09-12
Information query
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