A pad conditioning tool includes a sapphire substrate with a specific orientation plane, wherein the specific orientation plane is selected from a group consisting of a-plane, c-plane, r-plane, m-plane, n-plane and v-plane, the sapphire substrate further defining a mounting surface; and a plurality of sapphire dressing particles and a plurality of scrapers formed on the mounting surface of the substrate in a predetermined geometric arrangement, wherein the dressing particles are scattered between an adjacent pair of the scrapers. In case a wafer polishing pad is conditioned by the dressing particles of the pad conditioning tool, the scrapers are capable of removing abrasive waste and particles from the wafer polishing pad during a dressing operation, thereby forming new trenches and cilia structure on a polishing surface of the wafer polishing pad.