Invention Grant
- Patent Title: Insert molding method for connector
- Patent Title (中): 连接器插入成型方法
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Application No.: US13698900Application Date: 2011-07-07
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Publication No.: US09272450B2Publication Date: 2016-03-01
- Inventor: Motohisa Kashiyama , Masanobu Oishi
- Applicant: Motohisa Kashiyama , Masanobu Oishi
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-155500 20100708
- International Application: PCT/JP2011/066023 WO 20110707
- International Announcement: WO2012/005380 WO 20120112
- Main IPC: B29C45/14
- IPC: B29C45/14 ; H01R43/24 ; H05K3/30 ; H01R12/58 ; H01R43/20 ; H01R43/22 ; H05K3/34

Abstract:
To provide an insert molding method for a connector which enables terminals to be inserted easily into insertion destination places for the terminals. An insert-molding method for insert molding a connector 1 equipped with a plurality of terminals 10 integrated with a housing 40 and aligned in two rows, includes setting the plurality of terminals 10 in a housing mold 80 to uniform warping directions D of the terminals 10 so that the warping directions D are respectively directed toward outer sides of the rows of the terminals 10.
Public/Granted literature
- US20130062810A1 INSERT MOLDING METHOD FOR CONNECTOR Public/Granted day:2013-03-14
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