A thermally insulated VIP sandwich shipper for a temperature sensitive payload is provided. The shipper comprises an outer shell, an inner shell and vacuum insulated panels sandwiched therebetween. The outer shell and the inner shell may be unitary rigid structures made of an expanded foam material and comprising a bottom having a perimeter and sides extending from the bottom perimeter and terminating in a rim. The inner shell rim may be spaced from the outer shell rim to define a gap, the gap being sealed to create an enclosed space within which the vacuum insulated panels are located. Each vacuum insulated panel may be oriented substantially orthogonally to at least one adjacent vacuum insulated panel and have an edge that abuts the adjacent vacuum insulated panels.