Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US14219888Application Date: 2014-03-19
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Publication No.: US09272516B2Publication Date: 2016-03-01
- Inventor: Katsumi Enomoto , Shunsuke Watanabe
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2013-068285 20130328; JP2014-033774 20140225
- Main IPC: B41J2/165
- IPC: B41J2/165 ; B41J2/135 ; B41J2/14 ; B41J2/16

Abstract:
When a lower surface of a liquid ejecting head is formed by a nozzle plate and a cover member, a surface of the nozzle plate and a surface of the cover member are water-repellent surfaces and side surfaces of the nozzle plate and the cover member are relatively hydrophilic surfaces compared to the surfaces and a gap between the nozzle plate and the cover member is filled with a filling material. If at least the side surface of the nozzle plate is covered by the filling material, the nozzle plate can be protected from static electricity. Further, if the side surface of the cover member is filled with the filling material, wiping by a wiper is improved.
Public/Granted literature
- US20140292932A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2014-10-02
Information query
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