Invention Grant
- Patent Title: Integrated puncture repair kit
- Patent Title (中): 综合穿刺修复套件
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Application No.: US14364815Application Date: 2012-11-22
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Publication No.: US09272587B2Publication Date: 2016-03-01
- Inventor: Norio Taniguchi , Tsutomu Kono
- Applicant: SUMITOMO RUBBER INDUSTRIES, LTD.
- Applicant Address: JP Kobe-Shi
- Assignee: SUMITOMO RUBBER INDUSTRIES, LTD.
- Current Assignee: SUMITOMO RUBBER INDUSTRIES, LTD.
- Current Assignee Address: JP Kobe-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2012-001443 20120106
- International Application: PCT/JP2012/080310 WO 20121122
- International Announcement: WO2013/103055 WO 20130711
- Main IPC: B60C25/00
- IPC: B60C25/00 ; B29C73/16 ; B60S5/04 ; B29L30/00

Abstract:
An extraction cap of an integrated puncture repair kit is provided with: an intake unit for taking compressed air coming from a compressor into the extraction cap; an outlet unit for taking the intaken compressed air or both compressed air and a puncture repair solution to outside the extraction cap; a dedicated air flow path that ordinarily connects to the intake unit and provides conduction from the inlet unit to the outlet unit without passing through a bottle container; a dedicated puncture repair flow path comprising a first flow path section that is connected by a switching means to the intake unit instead of the dedicated air flow path and providing conduction from the intake unit into the bottle container, and a second flow path section providing conduction from inside the bottle container to the intake unit; a first on-off valve that is interposed in the second flow path section and ordinarily closes the first flow path section; and the switching means, which is actuated by downward pressing of a bottle unit and connects the intake unit switching from the dedicated air flow path to the dedicated puncture repair flow path, and also releases the first on-off valve to close the second flow path section.
Public/Granted literature
- US20140366981A1 INTEGRATED PUNCTURE REPAIR KIT Public/Granted day:2014-12-18
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