Invention Grant
- Patent Title: Top mount with MCU isolator in inner metal
- Patent Title (中): 内置金属配有MCU隔离器的顶部安装
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Application No.: US13733401Application Date: 2013-01-03
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Publication No.: US09272593B2Publication Date: 2016-03-01
- Inventor: Bryan D. Wilson
- Applicant: GM Global Technology Operations LLC
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: BrooksGroup
- Main IPC: B60G13/08
- IPC: B60G13/08 ; B60G11/22 ; B60G15/06

Abstract:
One variation may include a product comprising a top mount for a strut having a first inner strut rod attachment component comprising a metal, a second strut attachment component having at least a portion received in the first strut rod attachment component, a resilient or elastomeric material interposed between the first inner strut rod attachment component and the second inner strut rod attachment component, the second inner strut rod attachment component being constructed and arranged to receive a strut rod. One variation may include a product comprising a top mount for a strut having an inner strut rod attachment component, a first damping material and embedded in a resilient or elastomeric material, and wherein the first damping material has a greater damping property than the resilient or elastomeric material. One variation may include a product comprising an attachment collar for a strut rod, a microcellular urethane covering at least a portion of the collar.
Public/Granted literature
- US20140070511A1 TOP MOUNT WITH MCU ISOLATOR IN INNER METAL Public/Granted day:2014-03-13
Information query