Invention Grant
- Patent Title: Wiring harness
- Patent Title (中): 线束
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Application No.: US13577438Application Date: 2011-02-03
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Publication No.: US09272675B2Publication Date: 2016-03-01
- Inventor: Eiichi Toyama
- Applicant: Eiichi Toyama
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2010-023724 20100205
- International Application: PCT/JP2011/052250 WO 20110203
- International Announcement: WO2011/096478 WO 20110811
- Main IPC: H01R4/18
- IPC: H01R4/18 ; B60R16/02 ; H05K9/00 ; H01R4/28 ; H01R9/03

Abstract:
The invention relates to a wiring harness having a plurality of electrical wires and a tubular shielding member capable of accommodating the plurality of electrical wires as a whole therein. The wiring harness includes a plurality of electrical wires; and a tubular shielding member configured to receive the plurality of electrical wires as a whole, and coupled to a shield part of a device side via a tubular terminal portion thereof. The tubular shielding member includes a shielding body portion disposed over a bundled portion in which the plurality of electrical wires is bundled as a whole, and a shielding terminal portion disposed over an enlarged portion which gradually enlarges from the bundled portion in conformity with terminal arrangement of the plurality of electrical wires or a shape of the shield part of the device side, and continuous with at least one end of the shielding body portion. The shielding body portion is formed of metallic film and the shielding terminal portion is formed of braid.
Public/Granted literature
- US20130032393A1 WIRING HARNESS Public/Granted day:2013-02-07
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