Invention Grant
- Patent Title: Modular stanchion system
- Patent Title (中): 模块化支柱系统
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Application No.: US14265946Application Date: 2014-04-30
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Publication No.: US09272793B2Publication Date: 2016-03-01
- Inventor: Kim Marie Larson , Raymond Cho Eng , Clayton Lynn Munk , Dan Dresskell Day , Gordon Dale Davis
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Smith Moore Leatherwood LLP
- Agent Thomas W. Epting
- Main IPC: B64F5/00
- IPC: B64F5/00

Abstract:
An apparatus for supporting a wing assembly at a wing assembly support height. Base sections are provided, each having a different predetermined height with respect to one another. A movable platform carries a plurality of base sections, and a plurality of wing assembly support sections rest on base sections and include wing assembly connectors, which are movable in a first plane and a second plane generally perpendicular relative to the first plane. A differential height is defined between the wing assembly support height and the combined heights of the platform and the height of wing assembly connector, relative to the bottom of the wing assembly support section. At least one of the base sections is of a predetermined height approximating the differential height and is carried on the platform. The wing assembly support section is carried on such base section.
Public/Granted literature
- US20150344154A1 Modular Stanchion System Public/Granted day:2015-12-03
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