Invention Grant
- Patent Title: Integral hot melt adhesive packaging films and use thereof
- Patent Title (中): 一体热熔胶包装膜及其用途
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Application No.: US13800445Application Date: 2013-03-13
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Publication No.: US09272795B2Publication Date: 2016-03-01
- Inventor: Jinyu Chen , Yuhong Hu , Darshak Desai
- Applicant: HENKEL IP & HOLDING GMBH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: B32B1/02
- IPC: B32B1/02 ; B65B1/04 ; C08L23/12 ; C08L23/08 ; C09J123/14 ; B32B27/08 ; B32B27/20 ; B32B27/32 ; B32B1/08 ; B65B9/20
Abstract:
Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms.
Public/Granted literature
- US20130309427A1 INTEGRAL HOT MELT ADHESIVE PACKAGING FILMS AND USE THEREOF Public/Granted day:2013-11-21
Information query
