The disclosure is directed to a cutting process involving: (a) creating a starter crack using a scribe wheel, (b) application of laser or electrothermal heating, and (c) subsequent cooling from a gas or an aerosol jet, as the laser beam and cooling jet move along the desired cutting line. The cutting process can be implemented for cutting a glass panel or other substrate into a plurality of smaller panels. The starter crack may be created on any of the smaller panels within about 10 mm to about 20 mm from the corner of the smaller panel.