Invention Grant
- Patent Title: Hot melt assist waterborne adhesives and use thereof
- Patent Title (中): 热熔助剂水性胶粘剂及其用途
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Application No.: US13804230Application Date: 2013-03-14
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Publication No.: US09273230B2Publication Date: 2016-03-01
- Inventor: Tianjian Huang , Kristina Thompson , James Layser , John Harrington , John Meccia , Robert Mammarella
- Applicant: Henkel IP & Holding GmbH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: D06N7/00
- IPC: D06N7/00 ; D06N7/04 ; C09J5/08 ; B32B29/00 ; B32B7/12 ; C09J131/04
Abstract:
A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.
Public/Granted literature
- US20140141185A1 HOT MELT ASSIST WATERBORNE ADHESIVES AND USE THEREOF Public/Granted day:2014-05-22
Information query
